Atotech and Schweitzer Engineering Laboratories Announce Business Partnership

0

Reading time ( words)

Atotech, a leading specialty chemical technology company and market leader in advanced electroplating solutions, and Schweitzer Engineering Laboratories (SEL), an industry leader in the design and manufacture of digital products and systems that protect , control and automate electrical power systems, announced that they will partner with SEL’s state-of-the-art manufacturing facility being built in Idaho, USA.

SEL will utilize Atotech’s innovative Uniplate equipment technology in its new 162,000 square foot facility which will serve as the headquarters for SEL’s printed circuit board manufacturing operation. The Uniplate family of equipment is the industry standard for horizontal in-line printed circuit board processes, from cleaning and metallization to flash copper plating. The lines are expected to be commissioned in 2022.

John Hendrickson, Senior Director of Engineering at SEL, who will oversee SEL’s new operation, said: “As we begin to manufacture our own printed circuit boards, we are committed to building the PCB manufacturing facility the most modern, most environmentally friendly and safest in the United States. . Atotech is a leader in its field and the right partner for us. Their horizontal plating technology offers a simple approach to automation with a focus on reducing chemical usage. This will help us achieve our water recycling goals.

Atotech’s significant investment in environmentally friendly solutions benefits customers’ products and their production processes. These solutions reduce the production of water, chemicals, energy and waste, while reducing costs and meeting customer expectations for future PCB manufacturing.

“We are excited to work with SEL to meet their needs in Idaho,” said Harald Ahnert, President of Electronics Segment at Atotech. “The equipment selected by SEL combines years of Atotech’s engineering leadership for horizontal production equipment. The Uniplate® family brings a highly automated and environmentally friendly approach to PCB manufacturing.

SEL previously announced that local in-house production of the PCBs used in its digital products will give the company more freedom to experiment and innovate. It will also increase supply chain security and produce higher quality products.

Share


Suggested Articles

04/19/2022 | Dan Beaulieu, DB Management Group

Although there are many Chinese companies currently selling in the US, I wanted to find one in Taiwan that is entering the US market. I was delighted to meet EISO Enterprise Co. Ltd., a PCB manufacturer located in Taiwan. I know that American companies usually look for global PCB partners in countries other than China, which made my conversation with Gary (Jung Kun) Chien all the more interesting, especially when he shared his thoughts on the US-China trade wars.

04/14/2022 | Jordan Kologe and Leslie Kim, MacDermid Alpha Electronics Solutions

As the electronics supply chain grapples with the challenges of emerging from the pandemic and entering a new normal, there is growing evidence that a new normal will be one with sustainability and conservation resources as a top priority. Over the past year, we’ve seen printed circuit board manufacturers encounter challenges related to environmental regulations, water and power cuts, and supply chain pressures to reduce their environmental footprint. From the perspective of a board manufacturer, especially a specialized HDI manufacturer, a very resource-intensive step in the printed circuit board manufacturing process is the primary metallization step. All multi-layer printed circuit boards go through such a primary metallization, which is either electroless copper or direct metallization (DM).

04/04/2022 | John Strubbe, Taiwan Union Technology Corporation

Taiwan Union Technology Corporation (TUC) provides copper clad laminates and dielectric resin composites used to manufacture printed circuit boards. The enthalpy of these resin composites meets and exceeds customer targets and shows the deterioration of resin physical properties following multiple cycles of lamination (up to 10X). This article describes how TUC assesses the possible change in resin structure due to multi-thermal laminations.

Share.

Comments are closed.